MMBF2202PT1
PACKAGE DIMENSIONS
SC-70 (SOT-323)
CASE 419-04
ISSUE M
D
e1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3
MILLIMETERS
INCHES
H E
1
2
E
DIM
A
A1
A2
MIN
0.80
0.00
NOM MAX
0.90 1.00
0.05 0.10
0.7 REF
MIN
0.032
0.000
NOM
0.035
0.002
0.028 REF
MAX
0.040
0.004
b
c
0.30
0.10
0.35 0.40
0.18 0.25
0.012
0.004
0.014
0.007
0.016
0.010
e
b
D
E
e
1.80
1.15
1.20
2.10 2.20
1.24 1.35
1.30 1.40
0.071
0.045
0.047
0.083
0.049
0.051
0.087
0.053
0.055
e1
L
0.65 BSC
0.425 REF
0.026 BSC
0.017 REF
H E
2.00
2.10 2.40
0.079
0.083
0.095
A
A2
c
STYLE 8:
PIN 1. GATE
2. SOURCE
0.05 (0.002)
A1
L
3. DRAIN
SOLDERING FOOTPRINT*
0.65
0.65
0.025
0.025
1.9
0.075
0.9
0.035
0.7
0.028
SCALE 10:1
mm
inches
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MMBF2202PT1/D
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